Adherends with enhanced surfaces

ABSTRACT

Metallic substrates have a surface for receiving application of an adhesive that includes a precipitated coating of metallic nanoparticulates. A first portion of the nanoparticulates is adhered to the surface and a second portion is in contact with the first portion. Also provided are adhered constructs. These constructs include a first substrate with a first surface that has a metallic precipitated coating of nanoparticulates. A first portion of the nanoparticulates is adhered to the surface and a second portion contacts the first portion. The constructs include a second substrate that has a second surface; and an adhesive is applied between the first surface and the second surface.

This application is a divisional of U.S. application Ser. No.11/680,419, filed on Feb. 28, 2007, now U.S. Pat. No. 7,854,997.

TECHNICAL FIELD

The embodiments described herein generally relate to adherends withenhanced surfaces, and more particularly relates to metallic adherendswith nanoparticulate-enhanced surfaces that promote adhesion.

BACKGROUND

In manufacturing processes it is frequently necessary to join togethertwo or more substrates, for example two metal panels, or a metal panelto a plastic (“organic polymeric”) panel. While these may be joined witha variety of fasteners, or by welding or soldering, it is increasinglycommon to use an adhesive instead. The automobile and aerospaceindustries use high strength adhesives to form strong, long lastingbonds between substrates. Adhesives avoid the potential heat treatmentof metals that can occur during welding, and also avoid any puncturing,and thus weakening, of the substrates that may be required whenfasteners are used. Adhesive application can be readily controlled inautomated manufacturing processes. Adhesives can be used to join avariety of components together. The use of adhesives also allows twocomponent parts to be separated and a replacement for one component tobe joined to the other with another application of an adhesive.

The strength of an adhesive bond between adhered substrates depends upona variety of factors, including the strength of the bond between theadhesive and each substrate. This adhesive-substrate bond strength inturn depends upon several factors that include the condition andconfiguration of the substrate's surface when the adhesive is applied.Generally, at least some surface preparation treatments are carried outto prepare surfaces for receiving an adhesive. These might includecleaning off loose debris and degreasing. Of course, the larger thesurface area that is bonded, the stronger the bond. Surface enlargementmay be achieved by forming grooves or other irregularities on thesurface. But, in some instances, such modifications may mechanicallyweaken or alter the substrate. Accordingly, such surface enhancement maynot always be feasible or desirable.

Further, the longevity of an adhesive bond also depends on a variety offactors to which include the conditions it may be exposed to in ordinaryuse. For example, in the case of two metal panels adhered together, ifone panel is subjected to higher temperatures than the other, it mightbe expected to expand thermally relative to the adhesive because plasticadhesives have low coefficients of thermal expansion relative to metals.Further, since adhesives are not good conductors of heat, the adhesivewill conduct little heat to the other panel. This thermal expansion ofone panel relative to the adhesive and to the other panel imposesheat-induced stresses on the adhesive bond. If the temperature of theone panel tends to cycle, the repeated cyclical heat-induced stressesmay cause delamination.

Accordingly, it is desirable to provide adherends with enhanced surfacesfor receiving an adhesive to produce stronger adhesive bonds. Inaddition, it is desirable to improve thermal conductivity between twosubstrates that are bonded together so that differential thermalexpansion effects and the resultant tendency to delaminate are reducedFurthermore, other desirable features and characteristics of theenhanced adherend surfaces will become apparent from the subsequentdetailed description and the appended claims, taken in conjunction withthe accompanying drawings and the foregoing technical field andbackground.

BRIEF SUMMARY

Exemplary embodiments include metallic substrates that have aprecipitated coating on a surface for receiving application of anadhesive. The precipitated coating includes metal nanoparticulates. Afirst portion of the nanoparticulates is adhered to the surface forreceiving the adhesive, and a second portion of the nanoparticulates isin contact with the first portion.

Another exemplary embodiment provides adhered constructs. The constructsinclude a first substrate with a first surface that has been modifiedwith a precipitated coating of metallic nanoparticulates. A firstportion of the nanoparticulates is adhered to the surface and a secondportion of nanoparticulates is in contact with the first portion. Theconstruct includes a second substrate that has a second surface; and anadhesive is applied between the first surface and the second surface.

Another exemplary embodiment provides methods of enhancing a surface ofa substrate that include pre-treating the surface of the substrate,immersing the surface in a reaction precursor solution, andprecipitating metallic nanoparticulates from the solution to grow ontoand bond with a portion of the immersed surface.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments will hereinafter be described in conjunction withthe following drawing figures, wherein like numerals denote likeelements, and

FIG. 1 is a photomicrograph (including marked scale) of an exemplaryembodiment of CoNi alloy nanoparticulates;

FIG. 2 is a photomicrograph (including marked scale) of an exemplaryembodiment of CoNi alloy nanoparticulates;

FIG. 3 is a photomicrograph (including marked scale) of an exemplaryembodiment of CoNi alloy nanoparticulates;

FIG. 4 is a photomicrograph (including marked scale) of an exemplaryembodiment of CoNi alloy nanoparticulates;

FIG. 5 is a photomicrograph (including marked scale) of an exemplaryembodiment of CoNi alloy nanoparticulates;

FIG. 6 is schematic perspective view, not to scale, of a portion of anexemplary embodiment of an adhered construct;

FIG. 7 is an enlarged view of a portion of the adhered construct of FIG.6; and

FIG. 8 is a process flow diagram in accordance with an exemplaryembodiment.

DETAILED DESCRIPTION

The following detailed description is merely exemplary in nature and isnot intended to limit the described embodiments or the application anduses of the described embodiments. Furthermore, there is no intention tobe bound by any expressed or implied theory presented in the precedingtechnical field, background, brief summary or the following detaileddescription.

An exemplary embodiment provides adherends that have an enhanced surfacefor receiving an adhesive. The enhanced surface includes a continuous ordiscontinuous precipitated coating or layer of metallicnanoparticulates. In the specification and claims, the term“precipitated coating” refers to a coating formed by precipitation ofmetallic nanoparticulates onto a surface so that some nanoparticulatesbond to the surface while others that are not bonded the surface are incontact with the nanoparticulates that are bonded to the surface. Theprecipitated coatings may be continuous or discontinuous with someportions of the substrate surface area not covered by bondednanoparticulates. The nanoparticulates may occur in any of a variety ofshapes, for example starburst, rod, spherical, cylindrical, etc.Starburst nanoparticulates, for example, are shown in FIG. 1 and FIG. 2.Depending upon the nature of the nanoparticulate and process variablesduring production, as explained below, the nanoparticulates may betailored for size and shape. In general, the nanoparticulates are in thesize range from about 50 nm to about 1.0 micron, more typically in therange from about 150 nm to about 750 nm.

Some nanoparticulates closest to the surface may be chemically bound bycovalent or ionic bonds or van de Waal's forces to the surface and aretherefore “adhered” to the surface. Other nanoparticulates may be incontact with the covalently-bound nanoparticulates and multiples ofthese form clusters. In the exemplary embodiments of FIG. 3 and FIG. 4,the nanoparticulates may be present in clusters that extend in everydirection and that form networks of clusters on the surface. As shown inthe example of FIG. 4, the nanoparticulate clusters may be dense whenseen at high magnification, and yet dispersed on the surface, as shownin FIG. 5.

The nanoparticulates include at least one precipitated metal, or aprecipitate that includes two or more metals in a metal alloy. Beingmetallic, the nanoparticulates are thermally more conductive than anorganic polymeric adhesive. In general, as explained in more detailbelow, the precipitated metallic nanoparticulates may include any ofthose metals that (1) form salts that are soluble in non-aqueous (forexample, polyol and the like) and (2) that may be precipitated fromthese solutions as metallic precipitates. A non-limiting list ofsuitable metal salts for the non-aqueous solvent includes acetates,nitrates, sulfates, halides, carbonates, phosphates, and carboxylates.

The selection of salt and solvent may depend upon the nature of thesurface to be enhanced with nanoparticulates and/or the nature andconditions of the environment in which the adhesive-bonded product willbe used. In addition, if it is desired that the nanoparticulates enhancethermal conductivity, the metal should be selected, and processparameters adjusted, such that the precipitated metal forms clusters.When the cluster-enhanced surface is bonded to another surface, theclusters may extend to form a bridge to carry heat from the enhancedsurface to another surface bonded to it. Accordingly, appropriateselection of salt, solvent and process parameters permits tailoring ofthe enhanced surfaces for particular conditions, properties and uses.

The metal compounds that may be used include all metal compounds that apolyol can reduce to the corresponding metal (oxidation state=0).Non-limiting examples of such metals include main group metals such as,e.g., lead, tin, antimony and indium, and transition metals such as,e.g., gold, silver, copper, nickel, cobalt, palladium, platinum,iridium, osmium, rhodium, ruthenium, rhenium, vanadium, chromium,manganese, niobium, molybdenum, tungsten, tantalum, iron and cadmium.Examples of preferred metals include gold, silver, copper and nickel, inparticular, silver, copper, cobalt and nickel.

Non-limiting examples of suitable metal compounds include metal oxides,metal hydroxides (including hydrated oxides), metal salts of inorganicand organic acids such as, e.g., nitrates, nitrites, sulfates, halides(e.g., fluorides, chlorides, bromides and iodides), carbonates,phosphates, azides, borates (including fluoroborates, pyrazolylborates,etc.), sulfonates, carboxylates (such as, e.g., formates, acetates,propionates, oxalates and citrates), substituted carboxylates (includinghalogenocarboxylates such as, e.g., trifluoroacetates,hydroxycarboxylates, aminocarboxylates, etc.) and salts and acidswherein the metal is part of an anion (such as, e.g.,hexachloroplatinates, tetrachloroaurate, tungstates and thecorresponding acids).

Further non-limiting examples of suitable metal compounds includealkoxides, complex compounds (e.g., complex salts) of metals such as,e.g., beta-diketonates (e.g., acetylacetonates), complexes with amines,N-heterocyclic compounds (e.g., pyrrole, aziridine, indole, piperidine,morpholine, pyridine, imidazole, piperazine, triazoles, and substitutedderivatives thereof), aminoalcohols (e.g., ethanolamine, etc.), aminoacids (e.g., glycine, etc.), amides (e.g., formamides, acetamides,etc.), and nitriles (e.g., acetonitrile, etc.). Non-limiting examples ofpreferred metal compounds include nitrates, formates, acetates,trifluoroacetates, propionates, oxalates and citrates, particularlynitrates and acetates.

Non-limiting examples of specific metal compounds include silvernitrate, silver nitrite, silver oxide, silver fluoride, silver hydrogenfluoride, silver carbonate, silver oxalate, silver azide, silvertetrafluoroborate, silver acetate, silver propionate, silver butanoate,silver ethylbutanoate, silver pivalate, silver cyclohexanebutanoate,silver ethylhexanoate, silver neodecanoate, silver decanoate, silvertrifluoroacetate, silver pentafluoropropionate, silverheptafluorobutyrate, silver trichloroacetate, silver6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionate, silverlactate, silver citrate, silver glycolate, silver glyconate, silverbenzoate, silver salicylate, silver phenylacetate, silvernitrophenylacetate, silver dinitrophenylacetate, silverdifluorophenylacetate, silver 2-fluoro-5-nitrobenzoate, silveracetylacetonate, silver hexafluoroacetylacetonate, silvertrifluoroacetylacetonate, silver tosylate, silver triflate, silvertrispyrazolylborate, silver tris(dimethylpyrazolyl)borate, silver amminecomplexes, trialkylphosphine and triarylphosphine derivatives of silvercarboxylates, silver beta-diketonates, silver beta-diketonate olefincomplexes and silver cyclopentadienides; nickel oxide, nickel hydroxide,nickel chloride, nickel nitrate, nickel sulfate, nickel amminecomplexes, nickel tetrafluoroborate, nickel oxalate, nickelisopropoxide, nickel methoxyethoxide, nickel acetylacetonate, nickelformate, nickel acetate, nickel octanoate, nickel ethylhexanoate, andnickel trifluoroacetate; platinum formate, platinum acetate, platinumpropionate, platinum carbonate, platinum nitrate, platinum perchlorate,platinum benzoate, platinum neodecanoate, platinum oxalate, ammoniumhexafluoroplatinate, ammonium tetrachloroplatinate, sodiumhexafluoroplatinate, potassium hexafluoroplatinate, sodiumtetrachloroplatinate, potassium hexabromoplatinate, hexachloroplatinicacid, hexabromoplatinic acid, dihydrogen hexahydroxoplatinate, diammineplatinum chloride, tetraammine platinum chloride, tetraammine platinumhydroxide, tetraammine platinum tetrachloroplatinate, platinum(II)2,4-pentanedionate, diplatinum trisdibenzylideneacetonate, platinumsulfate and platinum divinyltetramethyldisiloxane; gold(III) acetate,gold(III) chloride, tetrachloroauric acid, gold azide, gold isocyanide,gold acetoacetate, imidazole gold ethylhexanoate and gold hydroxideacetate isobutyrate; palladium acetate, palladium propionate, palladiumethylhexanoate, palladium neodecanoate, palladium trifluoracetate,palladium oxalate, palladium nitrate, palladium chloride, tetraamminepalladium hydroxide, tetraammine palladium nitrate and tetraamminepalladium tetrachloropalladate; copper oxide, copper hydroxide, coppernitrate, copper sulfate, copper chloride, copper formate, copperacetate, copper neodecanoate, copper ethylhexanoate, coppermethacrylate, copper trifluoroacetate, copper acetoacetate and copperhexafluoroacetylacetonate; cobalt oxide, cobalt hydroxide, cobaltchloride and cobalt sulfate; ruthenium(III) chloride, ruthenium(III)acetylacetonate, ruthenium(III) acetate, ruthenium carbonyl complexes,ruthenium perchlorate, and ruthenium amine complexes; rhodium(III)chloride, rhenium(II) chloride, tin(II) oxide, iron(II) acetate, sodiumtungstate and tungstic acid.

The non-aqueous solvent may be a polyol. The suitable polyols may haveany number of hydroxyl groups (but at least two) and carbon atoms. Also,the polyol may comprise heteroatoms (such as, e.g., O and N), not onlyin the form of hydroxyl groups, but also in the form of, e.g., ether,ester, amine and amide groups and the like (for example, it may be apolyester polyol, a polyether polyol, etc.). Preferably, the polyolcomprises from about 2 to about 6 hydroxy groups (e.g., 2, 3 or 4hydroxy groups). Also, the preferred polyol comprises from 2 to about 12carbon atoms, e.g., up to about 3, 4, 5 or 6 carbon atoms. Aparticularly preferred group of polyols include the (alkylene) glycols,i.e., compounds which comprise two hydroxyl groups bound to adjacent(aliphatic or cycloaliphatic) carbon atoms. Usually these glycols willcomprise up to about 6 carbon atoms, e.g., 2, 3 or 4 carbon atoms.Ethylene glycol, propylene glycol and the butylene glycols arenon-limiting examples of preferred glycols.

The polyglycols constitute another group of preferred polyols includethe glycols. Specific and preferred examples thereof are compounds whichcomprise up to about 6 alkylene glycol units, e.g., up to 4 alkyleneglycol units such as, e.g., diethylene glycol, triethylene glycol,tetraethylene glycol, dipropylene glycol and tripropylene glycol.

Non-limiting examples of other specific compounds which mayadvantageously be used as the or a polyol include 1,2-propanediol,1,3-butanediol, 1,4-butanediol, glycerol, trimethylolpropane,pentaerythritol, triethanolamine and trihydroxymethylaminomethane.

Of course, it also is possible to use other polyols than those mentionedabove, either alone or in combination. For example, sugars and sugaralcohols can form at least a part of the polyol reactant. While polyolsthat are solid or semi-solid at room temperature may be employed, it ispreferred that the employed polyol or at least the employed mixture ofpolyols is liquid at room temperature, although this is not mandatory.Further, it is also possible to use one or more other reducing agents inconjunction with the polyol(s), for example, in order to reduce therequired reaction time and/or the reaction temperature. For instance,the substance that is capable of being adsorbed on the nanoparticles mayexhibit a reducing effect with respect to the metal compound. Anon-limiting example of such a substance is polyvinylpyrrolidone.

FIG. 6 illustrates an exemplary adhesive bonded construct 100 that has afirst panel 110, which may an aircraft skin panel of aluminum alloy,bonded with an adhesive 130 to a second panel 120. FIG. 7 is a schematicrepresentation to illustrate and explain a concept, and is not arepresentation of actual structure as may be seen under magnification.With this caveat, FIG. 7 illustrates that the surface 122 of secondpanel 120 is enhanced with a nanoparticulate precipitated coating 155formed in nanoparticulate clusters 150 thereon. The nanoparticulateclusters 150 extend from surface 122, are bonded with adhesive 130, andcontact surface 112 of first panel 110. Thus, the metallicnanoparticulate clusters 150 form an inter-panel bridge 160 through theadhesive matrix from first panel 110 to second panel 120. If thecomposition of the metallic nanoparticulate clusters 150 is selected forhigh heat transfer coefficient, then panel-to-panel heat transfer usingmultiples of such bridges 160 throughout the adhesive 130 is enhanced ascompared to constructs that lack such metallic inter-panel bridges 160.Salts of copper, cobalt, nickel, silver, gold, platinum and the likeconductive metals may be selected to provide heat conductive inter-panelbridges. Because of these bridges 160, any temperature differential thatmay ordinarily arise between bonded panels 110, 120 is reduced. Areduction in temperature differential reduces differential thermalexpansion between the panels 110, 120 and the adhesive 130. Thisreduction in thermal differential expansion in turn reduces anypotential for delamination.

FIG. 8 illustrates an exemplary embodiment of a process for enhancing asurface of an adherend 300. Other embodiments may use more or fewerprocess steps than illustrated. In general, a first process 310 includesadherend surface preparation. Surface preparation 310 may includeseveral steps such as removing loose debris from surfaces, cleaning withsoaps and/or detergents, sand or glass bead-blasting, degreasing, andthe like.

The cleaned surface of the adherend is now ready for surfacemodification to add nanoparticulates in process 312. Process 312includes adherend surface introduction or immersion in a solution fordescaling in process 315 and nanoparticulate precipitation, in process320, to produce a precipitated coating. De-scaling 315 removes anyprotective, relatively inert oxide scales that form under ordinaryambient conditions as a thin coating on certain metals and alloys, forexample on aluminum and its alloys. De-scaling 315 occurs prior tometallic precipitation because sodium hydroxide is present. Theadherend's surface may be masked to prevent nanoparticulateprecipitation onto these masked areas. In process 320, the solutionincludes a solvent and at least one dissolved metal salt. Thenon-aqueous solvent may be a polyol such as 1,2-propanediol, ethyleneglycol, propylene glycol, glycerol, other diols, and the like. The metalsalt should be soluble in the solvent, and its metal ion shouldprecipitate as a metallic nanoparticulate under process conditions.Typical salts (also listed above) include the metal acetates, chloridesnitrates phosphates, carbonates, sulfates, and the like. The metal ionsmay include cobalt, nickel, copper, silver, platinum, gold, and thelike. A combination of salts may be used. For example, nickel acetateand cobalt acetate in 1,2-propanediol to produce a cobalt-nickel alloyprecipitate.

In an exemplary method of forming CoNi alloy nanoparticulates on anadherend surface, 1.2 grams of cobalt (II) acetate tetrahydrate, 2.8grams of nickel (II) acetate tetrahydrate, 0.1 grams of ruthenium (III)chloride and 0.8 grams of NaOH (about 0.1 M concentration) may bedissolved in 200 mL of 1,2-propandiol. The adherend surface may beintroduced into the vessel containing the reaction precursors. Thevessel may be sealed and evacuated, followed by argon gas addition. Themixture may then be heated to about 170° C. for about 20 minutes. Oncereaction is complete, the mixture may be allowed to cool to roomtemperature. Once cooled, the nanoparticulate-precipitate-coatedadherend may be removed from the reaction vessel and washed with ethanol(or other alcohol) to remove polyol solution and allowed to dry in air.

In some embodiments, addition of a seeding agent may facilitateprecipitation of nanoparticulates. Ruthenium chloride is an example ofsuch a seeding agent, although other seeding agents and techniques, suchas ultra-sound, may also be used.

The size and shape of the nanoparticulate precipitate may be tailored byselection and control of process variables such as sodium hydroxideconcentration.

After precipitation of the nanoparticulates, the precipitate-coatedadherend surface may undergo post treatment processes 330, such asdraining of solvent from the enhanced surface, washing with de-ionizedwater, and drying in air or inert gas. To prevent re-scaling up of anyexposed surfaces prone to oxidation, the nanoparticulateprecipitate-coated adherend may be stored under an inert atmosphereuntil ready for bonding to create a construct, such as that shown inFIG. 6, for example.

During adhesive application to the nanoparticulate precipitate-coatedsurface, the adhesive flows into inter-cluster spaces and may coat atleast some of the nanoparticulates. When this adhesive sets, it providessome physical support for clusters of nanoparticulates that may be morefragile and preserves the structure of the network of clusters,especially the clusters that extend upward from the surface of theadherend. These upward extending clusters are the basis for bridges 160from the adherend 120 to the substrate 110 that will be adhered to it,as shown schematically in FIG. 7.

While at least one exemplary embodiment has been presented in theforegoing detailed description, it should be appreciated that a vastnumber of variations exist. It should also be appreciated that theexemplary embodiment or exemplary embodiments are only examples, and arenot intended to limit the scope, applicability, or configuration of thedescribed embodiments in any way. Rather, the foregoing detaileddescription will provide those skilled in the art with a convenient roadmap for implementing the exemplary embodiment or exemplary embodiments.It should be understood that various changes can be made in the functionand arrangement of elements without departing from the scope as setforth in the appended claims and the legal equivalents thereof.

1. A method of applying a precipitated coating to a surface of asubstrate, comprising: pretreating the surface of the substrate, whereinthe surface comprises a aluminum that is susceptible to oxide scaleformation; immersing the surface in a reaction precursor solution toremove oxide scale from the surface using sodium hydroxide; andprecipitating nanoparticulates from the solution to grow onto a portionof the immersed surface and form a precipitated coating.
 2. The methodof claim 1, wherein immersing the surface in the reaction precursorsolution comprises immersing the surface in a solution of metal saltscomprising ions of at least one of cobalt, nickel, copper, silver, gold,platinum, or tin.
 3. The method of claim 1, further comprising adding aseeding composition to initiate or enhance the precipitating of thenanoparticulates.
 4. The method of claim 1, wherein precipitatingcomprises precipitating metal nanoparticulates such that at least afirst portion of the nanoparticulates form clusters of nanoparticulatesand a second portion of the nanoparticulates adhere to the surface ofthe substrate, wherein the first portion is different than the secondportion.
 5. The method of claim 1, wherein the surface comprises a metalpanel, and wherein precipitating comprises precipitating cobalt-nickelnanoparticulates such that at least some of the cobalt-nickelnanoparticulates form clusters of cobalt-nickel nanoparticulates on themetal panel.
 6. The method of claim 1, wherein the surface is part of afirst panel to which a second panel is to be adhered.
 7. The method ofclaim 6, further comprising applying an adhesive onto the surface of thefirst panel such that the adhesive interacts with the precipitatedcoating.
 8. The method of claim 7, wherein the interaction between theadhesive and the precipitated coating comprises the adhesive flowinginto inter-cluster spaces formed by clusters of the nanoparticulates inthe precipitated coating.
 9. The method of claim 1, wherein the surfacecomprises an aluminum panel, and wherein immersing the surface comprisesentering the aluminum panel into a vessel containing the reactionprecursor solution.